Techmark Precision Instrument Co.,Ltd.
  • Home
  • About
  • Event
  • Products
  • Knowledge
  • Solutions
    • FAQ
    • Support
  • English
    • Applications

ApplicationS 

 ​Polymer/Bulk, Gel, Paste, Film

 The polymer Thermal Interface Material (TIM) Thermal Property modify by difference filler and partical . E.g 
  • Thermal Adhesive
  • Thermal Greases
  • Adhesive Tapes
  • Thermal Pad
Hot Disk can easy get thermal Conductivity, Thermal Diffusivity, Heat Capacity in one measurement.

【 TC Property 】
TPS 3500, TPS 2500S, TPS 2200, TPS 1500, TPS 500, TPS M1

 ​Metallic/Bulk, Film

The high Thermal Conductivity property Material E.g Gold, Silver, Aluminum, Copper, Alloy….High Thermal Conductivity, High Thermal Diffusivity, Low Cp with Bulk or Slab E.g
  • Heat Pipe
  • Heat Sink
  • Alloy slab
  • Al-Mg Slab
  • Li-Mg Slab
Hot Disk can easy get thermal Conductivity, Thermal Diffusivity, Heat Capacity in one measurement.

​
【 TC Property 】
TPS 3500, TPS 2500S, TPS 2200

 ​Ceramic/Bulk, Powder

  • Ceramic
  • Glass
  • Silicon Wafer
  • Aluminum Nitride
Apply on Electronic, Photo electronic….From Low thermal Conductivity to High Thermal Conductivity.

【 TC Property 】
TPS 3500, TPS 2500S, TPS 2200

 Composite Material/Slab, Bulk

  • PCB (Epoxy + Glass Fiber- Anisotropic Thermal Conductivity Property), 
  • IC Molding Compound (Expoy + Inorganic Filler- Anisotropic Thermal Conductivity Property, 
  • Thermal pad (Rubber + carbon Fiber or Glass Fiber—Anisotropic Thermal Conductivity Property).
  • Thermal Pipe (Alloy with carbon Fiber or graphite fiber- Anisotropic Thermal Conductivity Property) 
Hot Disk can measure X-Y Thermal Conductivity, Z Thermal Conductivity, X-Y Thermal Diffusivity, Z-Thermal Diffusivity 4 result in one measurement.

【 TC Property 】
TPS 3500, TPS 2500S, TPS 2200

 Nanomaterial

The solution or paste will change thermal property by additional Nano metal or ceramic particle. 
  • Thermal Exchange Material
  • Thermal Exchange solution
  • Nano material solution. 
Hot Disk can easy get thermal Conductivity, Thermal Diffusivity, Heat Capacity in one measurement.

【 TC Property 】
TPS 3500, TPS 2500S, TPS 2200

 Building Material

Building Material usually use air or form or porous property to decrease thermal Conductivity.
  • Insulator
  • Polymer Form
  • Ceramic Form
  • Polymer Film 
  • Porous polymer
  • Porous Ceramic

【 TC Property 】
TPS 3500, TPS 2500S, TPS 2200, TPS 1500, TPS 500, TPS M1

2019 Techmark Precision Instrument Co.,Ltd. All Rights Reserved.
  • Home
  • About
  • Event
  • Products
  • Knowledge
  • Solutions
    • FAQ
    • Support
  • English
    • Applications