Polymer/Bulk, Gel, Paste, Film
The polymer Thermal Interface Material (TIM) Thermal Property modify by difference filler and partical . E.g
【 TC Property 】
TPS 3500, TPS 2500S, TPS 2200, TPS 1500, TPS 500, TPS M1
- Thermal Adhesive
- Thermal Greases
- Adhesive Tapes
- Thermal Pad
【 TC Property 】
TPS 3500, TPS 2500S, TPS 2200, TPS 1500, TPS 500, TPS M1
Metallic/Bulk, Film
The high Thermal Conductivity property Material E.g Gold, Silver, Aluminum, Copper, Alloy….High Thermal Conductivity, High Thermal Diffusivity, Low Cp with Bulk or Slab E.g
【 TC Property 】
TPS 3500, TPS 2500S, TPS 2200
- Heat Pipe
- Heat Sink
- Alloy slab
- Al-Mg Slab
- Li-Mg Slab
【 TC Property 】
TPS 3500, TPS 2500S, TPS 2200
Ceramic/Bulk, Powder
Composite Material/Slab, Bulk
- PCB (Epoxy + Glass Fiber- Anisotropic Thermal Conductivity Property),
- IC Molding Compound (Expoy + Inorganic Filler- Anisotropic Thermal Conductivity Property,
- Thermal pad (Rubber + carbon Fiber or Glass Fiber—Anisotropic Thermal Conductivity Property).
- Thermal Pipe (Alloy with carbon Fiber or graphite fiber- Anisotropic Thermal Conductivity Property)
【 TC Property 】
TPS 3500, TPS 2500S, TPS 2200
Nanomaterial
The solution or paste will change thermal property by additional Nano metal or ceramic particle.
【 TC Property 】
TPS 3500, TPS 2500S, TPS 2200
- Thermal Exchange Material
- Thermal Exchange solution
- Nano material solution.
【 TC Property 】
TPS 3500, TPS 2500S, TPS 2200